JPS63157450A - 集積回路の冷却構造 - Google Patents

集積回路の冷却構造

Info

Publication number
JPS63157450A
JPS63157450A JP30381086A JP30381086A JPS63157450A JP S63157450 A JPS63157450 A JP S63157450A JP 30381086 A JP30381086 A JP 30381086A JP 30381086 A JP30381086 A JP 30381086A JP S63157450 A JPS63157450 A JP S63157450A
Authority
JP
Japan
Prior art keywords
integrated circuit
plate
case
circuit case
heat conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30381086A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573270B2 (en]
Inventor
Kazuo Maruyama
丸山 一男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP30381086A priority Critical patent/JPS63157450A/ja
Publication of JPS63157450A publication Critical patent/JPS63157450A/ja
Publication of JPH0573270B2 publication Critical patent/JPH0573270B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP30381086A 1986-12-22 1986-12-22 集積回路の冷却構造 Granted JPS63157450A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30381086A JPS63157450A (ja) 1986-12-22 1986-12-22 集積回路の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30381086A JPS63157450A (ja) 1986-12-22 1986-12-22 集積回路の冷却構造

Publications (2)

Publication Number Publication Date
JPS63157450A true JPS63157450A (ja) 1988-06-30
JPH0573270B2 JPH0573270B2 (en]) 1993-10-14

Family

ID=17925572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30381086A Granted JPS63157450A (ja) 1986-12-22 1986-12-22 集積回路の冷却構造

Country Status (1)

Country Link
JP (1) JPS63157450A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0512667U (ja) * 1991-07-29 1993-02-19 カヤバ工業株式会社 可変型油圧モータ

Also Published As

Publication number Publication date
JPH0573270B2 (en]) 1993-10-14

Similar Documents

Publication Publication Date Title
US6137682A (en) Air-cooled electronic apparatus
US5305185A (en) Coplanar heatsink and electronics assembly
US6603665B1 (en) Heat dissipating assembly with thermal plates
US5794454A (en) Cooling device for hard to access non-coplanar circuit chips
US4732281A (en) Mounting bracket assembly for electronic instrument mounting, heat dissipation and environmental protection
JPS63157449A (ja) 集積回路の冷却構造
US4665467A (en) Heat transfer mounting device
US5001601A (en) Modular cooling fixture for power transistors
US6483704B2 (en) Microprocessor heat sink retention module
US6310776B1 (en) Transverse mountable heat sink for use in an electronic device
JPS63157450A (ja) 集積回路の冷却構造
CN113382594A (zh) 电子组件及其散热组件
JP4140138B2 (ja) プリント基板の冷却構造
EP3882963A1 (en) Conductive thermal management architecture employing a stiffener of a printed wiring board assembly
RU2105441C1 (ru) Радиоэлектронный блок
US6324059B1 (en) Apparatus and method for improving heat sink component capacity and efficiency
JP3748733B2 (ja) 電子機器の放熱装置
JPS6324699A (ja) プリント回路基板取付け装置
TWI742570B (zh) 電子組件及其散熱組件
JP7506337B2 (ja) コンピューターシステム及びコンピューターシステムの製造方法
JPH0837389A (ja) ヒートパイプ式放熱装置
JP7706333B2 (ja) 電子デバイス用の熱伝導管理アーキテクチャ
JPS59155158A (ja) 半導体装置の冷却構造
JPH03250697A (ja) 電源冷却モジュール
JP2598317Y2 (ja) 電子部品の取付構造